In three preparation labs the EMC-DA provides a variety of methods to address the ever-growing demands for a sophisticated sample preparation. Beside conventional methods like dimpling precise grinding and polishing tools are available to produce thin sections and electron transparent wedges. All preparation steps can be performed water-free.
Furthermore, the EMC-DA provides different ion etch devices to address the material related defiance in the last preparation step.
By manipulating the etch parameters, TEM lamella of highest quality are prepared providing a minimum of structural an chemical artifacts.
- (Cryo-) Ultramicrotomy
- Electrochemical etching
- Various cutting-/grinding-/polishing devices
- Powder preparation
- Embedding devices